1. General information about the module
- Module code: PHY10635
- Vietnamese module designation: Quản lý nhiệt cho các linh kiện điện tử
- English module designation: Thermal management for electronics devices
- Credit points: 3
- Workload:
- Contact hours: lecture: 45, practice: 0
- Private study: 60
- Type of module: Specialization
- Required and recommended prerequisites for joining the module: None
2. Module objectives/intended learning outcomes
The Thermal Management for Electronic Components course equips students with fundamental knowledge of heat transfer, including basic heat transfer mechanisms such as conduction, convection, and radiation. From a general thermal model, specific thermal models are developed to identify key factors affecting the thermal characteristics of electronic components, such as thermal conductivity, geometric parameters, internal heat sources, and external heat sources.
Two types of thermal models are introduced: steady-state and transient-state models. The course applies these thermal models to the thermal management of electronic components, including light-emitting diode (LED) chips, photovoltaic components, thermoelectric generators (TEG), thermoelectric coolers (TEC), and integrated circuit (IC) chips.
Additionally, various solutions for mitigating the adverse effects of heat are presented, such as thermal damage control circuits, heat-dissipating packaging materials, active cooling technologies, and passive cooling techniques.
Mastering Thermal Management for Electronic Components enables graduates, engineers, and researchers to apply and develop thermal models for optimizing component performance, extending component lifespan, and ultimately building a strong foundation for careers in semiconductor technology.