SEM10008_Technology of semiconductor device packaging

  1. General course information
  • Course code: SEM10008   
  • Course title: SEMICONDUCTOR PACKAGING TECHNOLOGY
  • Course title in English: Technology of semiconductor device packaging
  • Credits: 3
  • Course structure:
  • Lecture hours: 45
  • Practical hours: 0
  • Tutorial hours: 0
  • Other (self-study hours): 90
  • Knowledge block: Disciplinary foundation
  • Prerequisites: None
  • Prior courses: None
  1. Brief course description:

The course “Semiconductor Packaging Technology” gives students an overview of semiconductor device packaging, of packaging materials, and of the physical phenomena affecting packaging performance. Packaging technologies covered include chip LED packaging, semiconductor laser packaging, solar-cell packaging, integrated-circuit packaging and thermoelectric device packaging. Besides the component level, packaging at the system level is also introduced.