- General course information
- Course code: SEM10104
- Course title: THERMAL MANAGEMENT FOR ELECTRONIC COMPONENTS
- Course title in English: Thermal management for electronics devices
- Credits: 3
- Course structure:
- Lecture hours: 45
- Practical hours: 0
- Tutorial hours: 0
- Other (self-study hours): 90
- Knowledge block: Specialisation
- Prerequisites: None
- Prior courses: None
- Brief course description:
The course “Thermal Management for Electronic Components” equips students with fundamental knowledge về heat transfer and its basic mechanisms, thermal convection and thermal radiation. Starting from a general thermal model, students build specific thermal models to identify the basic factors affecting a device's thermal behaviour: thermal conductivity, geometry, internal heat sources and external heat sources. Both steady-state and transient thermal models are introduced. Applications of thermal models to the thermal management of electronic components: chip, light-emitting diodes, solar cells, thermoelectric generators (TEG), thermoelectric coolers (TEC) and IC chips. Several applications and solutions for mitigating thermal damage are also presented: thermal-protection circuits, packaging materials that reduce heat accumulation, and active and passive cooling technologies. A solid grasp of “Thermal Management for Electronic Components” enables graduates, engineers and researchers to apply and develop thermal models in order to study and optimise device performance and extend device lifetime, giving them a firm foundation for a career in semiconductor technology.