1. General information about the module
Module code: PET10127
Vietnamese module designation: CÔNG NGHỆ ĐÓNG GÓI
English module designation: Semiconductor Packaging Technology
Credit points: 3
Workload:
- Contact Hours: Lectures, lessons: 45 hours (in class)
- Lab works, project, seminar: 0 hours
- Exercise: 0 hours
- Private study: 0 hours
Type of module: Specialized
Required and recommended prerequisites for joining the module: None
Modules taken before this module: None
2. Module objectives/intended learning outcomes
The Semiconductor Packaging Technology course provides students with an overview of semiconductor device packaging, including packaging materials and the physical phenomena that affect packaging performance and reliability.
The course covers various packaging technologies, including LED chip packaging, semiconductor laser packaging, solar cell packaging, integrated circuit (IC) packaging, and thermoelectric device packaging. In addition to component- and device-level packaging, the course also introduces system-level packaging, providing students with a broader understanding of packaging technologies and their applications across different levels of electronic and semiconductor systems.